features ? ? ? ? ? wide frequency range: 6 - 20 ghz ? ? ? ? ? high gain: 23 db ? ? ? ? ? low 50 ? ? ? ? ? noise figure: 2.0 db ? ? ? ? ? 50 ? ? ? ? ? input and output match ? ? ? ? ? single 3v supply bias applications ? ? ? ? ? microwave radio systems ? ? ? ? ? satellite vsat, dbs up/down link ? ? ? ? ? lmds & pt-pt mmw long haul ? ? ? ? ? broadband wireless access (including 802.16 and 802.20 wimax) ? ? ? ? ? wll and mmds loops ? ? ? ? ? commercial grade military description agilents AMMC-6220 is a high gain, low-noise amplifier that operates from 6 ghz to 20 ghz. this lna provides a wide-band solution for system design since it covers several bands, thus, reduces part inventory. the device has input / output match to 50 ohm, is unconditionally stable and can be used as either primary or sub-sequential low noise gain stage. by eliminating the complex tuning and assembly processes agilent AMMC-6220 6 ? 20 ghz low noise amplifier data sheet typically required by hybrid (discrete-fet) amplifiers, the AMMC-6220 is a cost-effective alternative in the 6 - 20 ghz communications receivers. the backside of the chip is both rf and dc ground. this helps simplify the assembly process and reduces assembly related performance variations and costs. it is fabricated in a phemt process to provide exceptional noise and gain performance. AMMC-6220 absolute maximum ratings [1] note: 1. operation in excess of any one of these conditions may result in permanent damage to this device note: these devices are esd sensitive. the following precautions are strongly recommended. ensure that an esd approved carrier is used when dice are transported from one destination to another. personal grounding is to be worn at all times when handling these devices chip size: 1700 x 800 mm (67 x 31.5 mils) chip size tolerance: 10mm (0.4 mils) chip thickness: 100 10mm (4 0.4 mils) pad dimensions: 100 x 100 mm (4 0.4 mils) symbol parameters/conditions units min. max. v d positive drain voltage v 7 v g gate supply voltage v na i d drain current ma 100 p in cw input power dbm 15 t ch operating channel temp. c +150 t stg storage case temp. c -65 +150 t max maximum assembly temp (60 sec max) c +300
2 gain at 12 ghz typical distribution of small signal gain, noise figure, and return loss. based on 1500 part sampled over several production lots. AMMC-6220 dc specifications/physical properties [1] AMMC-6220 rf specifications [3, 4, 5] (t a = 25c, v d =3.0 v, i d(q)= 55 ma, z o =50 ? ? ? ? ? ) notes: 1. ambient operational temperature t a =25c unless otherwise noted. 2. channel-to-backside thermal resistance (q ch-b ) = 26c/w at t channel (t c ) = 34c as measured using infrared microscopy. thermal resistance at backside temperature (t b ) = 25c calculated from measured data. notes: 3. small/large -signal data measured in wafer form t a = 25c. 4. 100% on-wafer rf test is done at frequency = 8, 12, and 18 ghz. 5. specifications are derived from measurements in a 50 ? test environment. aspects of the amplifier performance may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise ( opt) matching. 6. as derived from measured s-parameters return loss at 12 ghz noise figure at 12 ghz symbol parameters and test conditions units min. typ. max. i d drain supply current (under any rf power drive and temperature) (v d =3.0 v) ma 55 70 v g gate supply operating voltage (i d(q) = 800 (ma)) vna q ch-b thermal resistance [2] (backside temperature, t b = 25c) c/w 25 symbol parameters and test conditions units minimum typical maximum sigma gain small-signal gain [6] db 21 23 0.30 nf noise figure into 50 ? db 7-10 ghz = 2.1 10-16 ghz = 1.8 16-20 ghz = 2.0 8 ghz = 2.4 12 ghz = 2.2 18 ghz = 2.4 0.10 p- 1db output power at 1db gain compression dbm +9 0.87 oip3 third order intercept point; ? f=100mhz; pin=-35dbm dbm +19 1.20 rlin input return loss [6] db -12 -10 0.31 rlout output return loss [6] db -16 -10 0.68 isol reverse isolation [6] db -45 0.50 lsl 22 23 24 usl -11.6 -11.3 -11 -10.7 -10.4 -10.1 -9.8 -9.5 usl 1.7 1.8 1.9
3 AMMC-6220 typical performances (t a = 25c, v d =3.0 v, i d = 55 ma, z in = z out = 50 ? ? ? ? ? unless otherwise stated) note: these measurements are in a 50 ? test environment. aspects of the amplifier performance may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise ( opt) matching.figure 1. typical gain figure 2. typical isolation figure 9. typical input return loss (s11) over temperature figure 8. typical isolation (s12) over temperature figure 7. typical gain (s21) over temperature figure 6. typical output p -1db and 3 rd order intercept pt. figure 5. typical noise figure into a 50 w load. figure 4. typical output return loss figure 3 typical input return loss 0 5 10 15 20 25 6 8 10 12 14 16 18 20 frequency (ghz) gain (db) -60 -50 -40 -30 -20 -10 0 6 8 10 12 14 16 18 20 frequency (ghz) isolation (db) -20 -15 -10 -5 0 6 8 10 12 14 16 18 20 frequency (ghz) input return loss(db) -60 -50 -40 -30 -20 -10 0 4 6 8 10121416182022 frequency (ghz) s12 (db) 25degc -40degc +85degc -20 -15 -10 -5 0 4 6 8 10121416182022 frequency (ghz) s11 (db) 25degc -40degc +85degc figure 1. typical gain 0 5 10 15 20 25 30 4 6 8 10121416182022 frequency (ghz) s21 (db) 25degc -40degc +85degc -30 -20 -10 0 6 8 10 12 14 16 18 20 frequency (ghz) output return loss (db) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 6 8 10 12 14 16 18 20 frequency [ghz] noise figure [db] 0 5 10 15 20 25 6 8 10 12 14 16 18 20 frequency [ghz] op1db (dbm) 0 5 10 15 20 25 oip3 (dbm)
4 figure 10. typical output return loss over temperature figure 11. typical noise figure over temperature figure 12. typical total idd over temperature figure 13. typical gain over vdd (supply voltage.) figure 14. typical isolation over vdd (supply voltage) figure 15. typical input return loss over vdd (supply voltage) figure 16. typical output return loss over vdd (supply voltage) figure 17. typical noise figure over vdd (supply voltage.) figure 18. typical op -1db over vdd (supply voltage.) AMMC-6220 typical performances (t a = 25c, v d =3.0 v, i d = 55 ma, z in = z out = 50 ? ? ? ? ? unless otherwise stated) note: these measurements are in a 50 ? test environment. aspects of the amplifier performance may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise ( opt) matching. -30 -25 -20 -15 -10 -5 0 4 6 8 10 12 14 16 18 20 22 frequency (ghz) s22 (db) 25degc -40degc +85degc -60 -50 -40 -30 -20 -10 0 4 6 8 101214161820 frequency (ghz) s12 (db) 3v 4v 5v 0.00 0.50 1.00 1.50 2.00 2.50 3.00 6 8 10 12 14 16 18 20 frequency (ghz) nf (db) 3v 4v 5v 0 2 4 6 8 10 12 6 8 10 12 14 16 18 20 frequency (ghz) op1db (dbm) 3v 4v 5v 0 0.5 1 1.5 2 2.5 3 3.5 4 6 8 10 12 14 16 18 20 frequency (ghz) nf (db) -40degc 25degc +85degc 50 52 54 56 58 60 62 3 3.5 4 4.5 5 vdd (v) idd (ma) -40degc +25degc +85degc 0 5 10 15 20 25 30 4 6 8 101214161820 frequency (ghz) s21 (db) 3v 4v 5v -20 -15 -10 -5 0 4 6 8 101214161820 frequency (ghz) s11 (db) 3v 4v 5v -35 -30 -25 -20 -15 -10 -5 0 4 6 8 10 12 14 16 18 20 frequency (ghz) s22 (db) 3v 4v 5v
5 AMMC-6220 typical scattering parameters [1] (tc=25c, v d1 =v d2 = 3 v, z in = z out = 50 ? ? ? ? ? ) note: data obtained from on-wafer measurements s11 s21 s12 s22 freq ghz db mag phase db mag phase db mag phase db mag phase 4.000 -0.146 0.983 103.687 9.033 2.829 -128.237 -48.748 0.004 -115.810 -4.132 0.621 171.001 4.500 -1.392 0.852 74.728 21.862 12.391 118.600 -41.044 0.009 103.896 -13.516 0.211 141.837 5.000 -0.823 0.910 37.284 23.130 14.338 39.967 -44.986 0.006 29.720 -16.564 0.149 168.028 5.500 -1.961 0.798 -3.456 23.710 15.328 -15.875 -46.775 0.005 -28.575 -17.481 0.134 -175.481 6.000 -5.151 0.553 -33.435 23.699 15.310 -59.866 -50.848 0.003 -45.938 -17.158 0.139 -166.821 6.500 -7.415 0.426 -53.353 23.622 15.174 -95.795 -51.753 0.003 -76.787 -16.707 0.146 -164.516 7.000 -10.150 0.311 -65.197 23.557 15.060 -126.279 -52.284 0.002 -109.752 -16.549 0.149 -165.262 7.500 -11.146 0.277 -71.056 23.641 15.207 -153.658 -52.173 0.002 -108.492 -16.750 0.145 -165.145 8.000 -11.953 0.253 -76.086 23.761 15.419 -179.298 -51.490 0.003 -134.195 -16.835 0.144 -165.958 8.500 -11.917 0.254 -79.875 23.793 15.475 156.812 -50.677 0.003 -149.675 -17.025 0.141 -166.708 9.000 -11.731 0.259 -85.876 23.908 15.681 133.712 -50.500 0.003 -159.105 -17.310 0.136 -167.942 9.500 -11.478 0.267 -93.111 24.000 15.849 111.612 -50.296 0.003 -171.408 -17.862 0.128 -168.952 10.000 -11.328 0.271 -100.430 24.071 15.979 90.667 -48.911 0.004 -176.724 -18.509 0.119 -168.793 10.500 -11.278 0.273 -107.107 23.989 15.829 70.398 -49.083 0.004 174.601 -19.271 0.109 -166.105 11.000 -11.184 0.276 -114.292 23.915 15.695 50.874 -48.773 0.004 155.804 -19.908 0.101 -161.607 11.500 -11.267 0.273 -119.551 23.867 15.607 31.947 -47.506 0.004 155.799 -20.309 0.097 -153.779 12.000 -11.033 0.281 -125.024 23.786 15.464 14.018 -47.811 0.004 150.219 -20.177 0.098 -146.759 12.500 -10.820 0.288 -130.580 23.724 15.354 -3.874 -46.361 0.005 124.708 -19.456 0.106 -141.031 13.000 -10.768 0.289 -136.143 23.620 15.170 -20.953 -46.149 0.005 119.468 -18.642 0.117 -137.531 13.500 -10.685 0.292 -140.774 23.568 15.081 -37.794 -45.536 0.005 120.694 -17.844 0.128 -136.674 14.000 -10.672 0.293 -147.067 23.459 14.891 -54.252 -44.238 0.006 108.871 -17.088 0.140 -136.397 14.500 -10.611 0.295 -151.974 23.351 14.707 -70.766 -44.824 0.006 98.487 -16.419 0.151 -137.700 15.000 -10.629 0.294 -157.342 23.287 14.600 -86.927 -43.591 0.007 85.314 -15.782 0.163 -140.788 15.500 -10.792 0.289 -164.023 23.184 14.428 -102.737 -42.101 0.008 81.787 -15.469 0.168 -145.110 16.000 -11.118 0.278 -169.248 23.119 14.320 -119.061 -41.806 0.008 64.948 -15.429 0.169 -150.386 16.500 -11.744 0.259 -173.681 22.973 14.082 -135.063 -40.650 0.009 63.398 -15.606 0.166 -156.073 17.000 -12.571 0.235 -176.840 22.847 13.879 -151.033 -41.699 0.008 48.516 -16.000 0.158 -160.598 17.500 -13.207 0.219 -179.413 22.728 13.689 -166.718 -40.813 0.009 43.851 -16.795 0.145 -166.616 18.000 -14.063 0.198 -176.351 22.548 13.409 176.850 -40.203 0.010 34.195 -17.791 0.129 -173.574 18.500 -14.853 0.181 -172.040 22.336 13.086 160.709 -39.642 0.010 21.429 -19.662 0.104 178.090 19.000 -14.720 0.184 -161.713 22.122 12.767 144.491 -39.641 0.010 20.910 -22.604 0.074 169.680 19.500 -13.710 0.206 -153.813 21.797 12.298 128.151 -39.632 0.010 8.070 -28.897 0.036 148.784 20.000 -12.221 0.245 -148.391 21.451 11.819 111.521 -38.926 0.011 -7.980 -35.137 0.018 31.294 20.500 -10.382 0.303 -147.276 20.983 11.198 95.148 -39.251 0.011 -13.094 -23.741 0.065 -15.174 21.000 -8.701 0.367 -150.640 20.472 10.558 78.624 -38.616 0.012 -25.399 -18.636 0.117 -26.892 21.500 -7.194 0.437 -156.785 19.879 9.862 62.593 -38.726 0.012 -35.505 -15.322 0.171 -36.809 22.000 -5.883 0.508 -163.716 19.198 9.118 47.073 -38.915 0.011 -38.784 -12.780 0.230 -45.747
6 AMMC-6220: typical scattering parameters [1] (tc=25c, v d1 =v d2 = 5 v, z in = z out = 50 ? ? ? ? ? ) note: data obtained from on-wafer measurements s11 s21 s12 s22 freq ghz db mag phase db mag phase db mag phase db mag phase 9.500 -11.478 0.267 -93.111 24.000 15.849 111.612 -50.296 0.003 -171.408 -17.862 0.128 -168.952 10.000 -11.328 0.271 -100.430 24.071 15.979 90.667 -48.911 0.004 -176.724 -18.509 0.119 -168.793 10.500 -11.278 0.273 -107.107 23.989 15.829 70.398 -49.083 0.004 174.601 -19.271 0.109 -166.105 11.000 -11.184 0.276 -114.292 23.915 15.695 50.874 -48.773 0.004 155.804 -19.908 0.101 -161.607 11.500 -11.267 0.273 -119.551 23.867 15.607 31.947 -47.506 0.004 155.799 -20.309 0.097 -153.779 12.000 -11.033 0.281 -125.024 23.786 15.464 14.018 -47.811 0.004 150.219 -20.177 0.098 -146.759 12.500 -10.820 0.288 -130.580 23.724 15.354 -3.874 -46.361 0.005 124.708 -19.456 0.106 -141.031 13.000 -10.768 0.289 -136.143 23.620 15.170 -20.953 -46.149 0.005 119.468 -18.642 0.117 -137.531 13.500 -10.685 0.292 -140.774 23.568 15.081 -37.794 -45.536 0.005 120.694 -17.844 0.128 -136.674 14.000 -10.672 0.293 -147.067 23.459 14.891 -54.252 -44.238 0.006 108.871 -17.088 0.140 -136.397 14.500 -10.611 0.295 -151.974 23.351 14.707 -70.766 -44.824 0.006 98.487 -16.419 0.151 -137.700 15.000 -10.629 0.294 -157.342 23.287 14.600 -86.927 -43.591 0.007 85.314 -15.782 0.163 -140.788 15.500 -10.792 0.289 -164.023 23.184 14.428 -102.737 -42.101 0.008 81.787 -15.469 0.168 -145.110 16.000 -11.118 0.278 -169.248 23.119 14.320 -119.061 -41.806 0.008 64.948 -15.429 0.169 -150.386 16.500 -11.744 0.259 -173.681 22.973 14.082 -135.063 -40.650 0.009 63.398 -15.606 0.166 -156.073 17.000 -12.571 0.235 -176.840 22.847 13.879 -151.033 -41.699 0.008 48.516 -16.000 0.158 -160.598 17.500 -13.207 0.219 -179.413 22.728 13.689 -166.718 -40.813 0.009 43.851 -16.795 0.145 -166.616 18.000 -14.063 0.198 -176.351 22.548 13.409 176.850 -40.203 0.010 34.195 -17.791 0.129 -173.574 18.500 -14.853 0.181 -172.040 22.336 13.086 160.709 -39.642 0.010 21.429 -19.662 0.104 178.090 19.000 -14.720 0.184 -161.713 22.122 12.767 144.491 -39.641 0.010 20.910 -22.604 0.074 169.680 19.500 -13.710 0.206 -153.813 21.797 12.298 128.151 -39.632 0.010 8.070 -28.897 0.036 148.784 20.000 -12.221 0.245 -148.391 21.451 11.819 111.521 -38.926 0.011 -7.980 -35.137 0.018 31.294 20.500 -10.382 0.303 -147.276 20.983 11.198 95.148 -39.251 0.011 -13.094 -23.741 0.065 -15.174 21.000 -8.701 0.367 -150.640 20.472 10.558 78.624 -38.616 0.012 -25.399 -18.636 0.117 -26.892 21.500 -7.194 0.437 -156.785 19.879 9.862 62.593 -38.726 0.012 -35.505 -15.322 0.171 -36.809 22.000 -5.883 0.508 -163.716 19.198 9.118 47.073 -38.915 0.011 -38.784 -12.780 0.230 -45.747 biasing and operation the AMMC-6220 is normally biased with a single positive drain supply connected to both v d1 and v d2 bond pads through the 2 bypass capacitors as shown in figure 20. the recommended supply voltage is 3 v. it is important to have 2 separate 100pf bypass capacitors, and these two capacitors should be placed as close to the die as possible. the AMMC-6220 does not require a negative gate voltage to bias any of the three stages. no ground wires are needed because all ground connections are made with plated through- holes to the backside of the device. refer the absolute maximum ratings table for allowed dc and thermal conditions
7 assembly techniques the backside of the mmic chip is rf ground. for microstrip applications the chip should be attached directly to the ground plane (e.g. circuit carrier or heatsink) using electrically conductive epoxy [1] for best performance, the topside of the mmic should be brought up to the same height as the circuit surrounding it. this can be accomplished by mounting a gold plate metal shim (same length and width as the mmic) under the chip which is of correct thickness to make the chip and adjacent circuit the same height. the amount of epoxy used for the chip and/or shim attachment should be just enough to provide a thin fillet around the bottom perimeter of the chip or shim. the ground plan should be free of any residue that may jeopardize electrical or mechanical attachment. the location of the rf bond pads is shown in figure 12. note that all the rf input and output ports are in a ground- signal-ground configuration. the chip is 100um thick and should be handled with care. this mmic has exposed air bridges on the top surface and should be handled by the edges or with a custom collet (do not pick up the die with a vacuum on die center). this mmic is also static sensitive and esd precautions should be taken. notes: [1] ablebond 84-1 lm1 silver epoxy is recommended. [2] buckbee-mears corporation, st. paul, mn, 800-262-3824 rf connections should be kept as short as reasonable to minimize performance degradation due to undesirable series inductance. a single bond wire is normally sufficient for signal connections, however double bonding with 0.7 mil gold wire or use of gold mesh [2] is recommended for best performance, especially near the high end of the frequency band. thermosonic wedge bonding is preferred method for wire attachment to the bond pads. gold mesh can be attached using a 2 mil round tracking tool and a tool force of approximately 22 grams and a ultrasonic power of roughly 55 db for a duration of 76 +/- 8 ms. the guided wedge at an untrasonic power level of 64 db can be used for 0.7 mil wire. the recommended wire bond stage temperature is 150 +/- 2c. caution should be taken to not exceed the absolute maximum rating for assembly temperature and time. figure 19. AMMC-6220 schematic in vcc out
www.agilent.com/ semiconductors for product information and a complete list of distributors, please go to our web site. data subject to change. copyright ? 2004 agilent technologies, inc. october 4, 2004 5989-1706en figure 20. AMMC-6220 bonding pad locations figure 21. AMMC-6220 assembly diagram rf input rf output v d1 v d2 gold plated shim (optional) 100 pf capacitors to v dd dc supply AMMC-6220 0 0 330 800 0 700 870 1045 1700 800 330 0 1700 705 90 1600 rfin rfout vd1 vd2
|
